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Optimization of an automotive power semiconductor switch module using inlay PCB technology
Chae-Won Kim Han-Jin Do Tae-Young Hwang Shi-Hong Park
Vol. 21, No. 4, pp. 660-671, Apr. 2021
10.1007/s43236-020-00211-7
Vol. 21, No. 4, pp. 660-671, Apr. 2021
10.1007/s43236-020-00211-7
ISSN : 1598 - 2092
eISSN : 2093 - 4718